BREAKING NEWS: BVM’s new LS-37K 3.5” SBC based on 6th generation Skylake and 7th generation Kaby Lake      Anritsu, Teledyne LeCroy Integrate Best-in-Class Solutions to Create Industry’s Most Comprehensive PCI Express® 4.0 Test System      Imaging SOCs from ON Semiconductor enable big vision with smaller automotive cameras      Chip resistor is cheaper than a grain of rice, but supply is now the issue      Murata’s DC-DC converter offers efficient drop in replacement for 78xx linear regulator in harsh environments     

BVM’s new LS-37K 3.5” SBC based on 6th generation Skylake and 7th generation Kaby Lake

Oct 17, 2017

Further extending its 3.5”  format industrial grade embedded SBC portfolio, BVM has announced the LS-37K, which offers a 30% performance improvement and power reduction over Ivy Bridge based Read more...

Anritsu, Teledyne LeCroy Integrate Best-in-Class Solutions to Create Industry’s Most Comprehensive PCI Express® 4.0 Test System

Oct 17, 2017

MP1900A BERT with LabMaster 10Zi-A Oscilloscope Performs Automated PCIe Gen4 Transmitter, Receiver and Link Equalization Tests with Support Up To 32 Gb/s   Anritsu Company U.S. and Teledyne LeCroy announce Read more...

New small quantities storage facility at Rutronik

Oct 17, 2017

Rutronik Elektronische Bauelemente GmbH has set up a small quantities storage facility. The new storage facility allows the distributor from Ispringen to quickly supply development engineers and companies Read more...

EnOcean Alliance to exhibit at Smart Buildings Show 2017:The self-powered wireless standard for smart buildings

Oct 17, 2017

The organization will be presenting its maintenance-free wireless solutions, creating a network for the integrated control of smart buildings and IoT applications based on the seamless integration of Read more...

Cliff FT Connectors now available pre-assembled into 1U, 19” rack Panels

Oct 17, 2017

Cliff Electronics is now offering system integrators 1U, 19” rack panels pre-assembled with up to 16 of their market–leading Feedthrough (FT) connectors to simplify system assembly, reduce manufacturing Read more...

Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX™ Process Technology

Oct 17, 2017

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES 22FDX™ Read more...

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