BREAKING NEWS: Mouser Offers Amphenol Advanced Sensors’ Air Quality Eval Boards      Cadence Collaborates with TSMC to Drive Innovation Using New 12FFC Process Technology      Optimas Components launches comprehensive family of expandable braided sleeving products from Techflex at Southern Manufacturing      Toshiba to Preview Next-Generation FlashAir™ Wireless SD Card at CeBIT 2017      The Drive for Advancements in Automotive Fuses     
Breaking News

Barco Silex and Imagination collaborate on SoC security

Mar 21, 2017

Imagination’s Trusted Element IP to integrate Barco Silex’ eSecure solution for MIPS platforms   Imagination Technologies (IMG.L) and Barco Silex today announced a collaboration through which they are developing IP for secure system-on-chip (SoC) platforms based on Imagination’s MIPS family of processors. Imagination will integrate Barco Silex’ eSecure solution for embedded security into a new
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Elesa – high performing Stainless Steel Standard Components

The Elesa stainless steel program of standard components offers high performance in all areas – they are rugged and corrosion-resistant, with classic design style so as to enhance any equipment to which they are fitted. Spoked handwheels, locking lobe knobs and hook clamps are coupled with fluid levels, levelling feet, hinges and castors in this
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Cadence Collaborates with TSMC to Drive Innovation Using New 12FFC Process Technology

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced its collaboration with TSMC to further advanced-node design innovation with TSMC’s new 12nm FinFET Compact (12FFC) process technology. With Cadence® digital and signoff solutions, custom/analog solutions and IP, system-on-chip (SoC) designers can use the 12FFC process to create emerging mid-range mobile and high-end consumer applications that require
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Nexperia emerges as dynamic new force in Discretes, Logic and MOSFETs

Mar 14, 2017

Former Standard Products Division of NXP combines experience, product and operational excellence with customer focus and ambition   Nexperia, the former Standard Products division of NXP, today announced the formal completion of its launch as a separate entity. Headquartered in Nijmegen, Netherlands and backed by a consortium of financial investors consisting of Beijing Jianguang Asset
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AWS Electronics Gains Full TS 16949:2009 Approval for Slovakia Facility

Cements AWS’ position as leading EMS provider for Automotive market   AWS Electronics Group, one of Europe’s leading specialist electronics manufacturing services (EMS) providers, has announced that its facility in Námestovo, Slovakia, has achieved full TS 16949 certification, the international standard for Automotive Quality Management Systems. AWS Electronics has invested significantly in its Slovakia facility
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Innovation in diverse, fast moving and high-profile sectors for ON Semiconductor at Embedded World

Enabling technologies and unique tools to speed and simplify design and development in the IoT, portable device power delivery and automotive imaging markets   Embedded World 2017 – Hall 4A, Stand 110 – NUREMBERG, Germany – March 13, 2017 – ON Semiconductor (Nasdaq: ON), driving energy efficient innovations, will focus on technologies for three of
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World’s first medically-accurate health monitoring system integrated in a smartphone now readied for FDA approval by Leman Micro Devices

Blood pressure and other vital signs system accuracy already proven in trials.Monitor your health using just your smartphone in 60 seconds with no cuff,no pain…and no cost   Leman Micro Devices (LMD), the developer of accredited consumer healthcare products that is backed by major players within the mobile device industry, has announced that its Health
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Yokogawa collaborates with four companies to develop IIoT architecture

Feb 7, 2017

Expanding the use of IIoT to help our customers run their businesses more efficiently   Yokogawa Electric Corporation announces that it will work with Microsoft Corporation, FogHorn Systems, Inc., Bayshore Networks, Inc., and Telit IoT Platforms, LLC to integrate their technology into an industrial IoT (IIoT) architecture for the delivery of new services. With this
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Murata to exhibit cutting-edge technology and live Cheerleaders demonstration at CeBIT

CeBIT – Hall 4, Element Zone of the Japan Pavilion   Murata will exhibit at CeBIT, the world’s largest trade show for IT solutions from March 20-24 2017. The event, which will take place at the Hannover Exhibition Grounds, Hannover, Germany is expected to see 200,000 visitors through the doors. Booths from 3,300 companies from
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Amkor Technology to Acquire NANIUM

Amkor Technology, Inc. (Nasdaq: AMKR) and NANIUM S.A. today announced that they have entered into a definitive agreement for Amkor to acquire NANIUM, a world class provider of wafer-level fan-out (WLFO) semiconductor packaging solutions. Terms of the transaction were not disclosed. The acquisition of NANIUM will strengthen Amkor’s position in the fast growing market of
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