BREAKING NEWS: BVM’s new LS-37K 3.5” SBC based on 6th generation Skylake and 7th generation Kaby Lake      Anritsu, Teledyne LeCroy Integrate Best-in-Class Solutions to Create Industry’s Most Comprehensive PCI Express® 4.0 Test System      Imaging SOCs from ON Semiconductor enable big vision with smaller automotive cameras      Chip resistor is cheaper than a grain of rice, but supply is now the issue      Murata’s DC-DC converter offers efficient drop in replacement for 78xx linear regulator in harsh environments     
Breaking News

Embedded face recognition module first at electronica

Nov 4, 2014

Omron Electronic Components Europe will be demonstrating its embedded face and gesture recognition module for the first time in public at electronica. New relays and switches for smart meters, electric vehicles, renewable energy systems and general industrial applications will also be featured on Omron’s stand A5-163. Electronica visitors will be first to see demonstrations of
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Vishay Intertechnology Enhances PTN Series Precision Thin Film Chip Resistors

Devices Now Available With Lower Absolute TCR of ± 10 ppm/°C and Tighter Tolerances of ± 0.05 % Vishay Intertechnology, Inc. (NYSE: VSH) today announced that it has enhanced its PTN series of precision surface-mount thin film chip resistors with a lower absolute TCR of ± 10 ppm/°C and tighter tolerances to ± 0.05 %.
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New microwave power module provides switchable Ka/Q-band capability for UAV data links

Now available from Link Microtek is a switchable Ka/Q-band microwave power module (MPM) that provides highly compact power-amplifier functionality for defence and aerospace applications where size and weight are key considerations. Designed and manufactured by L-3 Electron Devices, the M2837 module delivers more than 100W of saturated CW power at Ka-band frequencies from 29.5 to
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Intersil to Showcase Its Power Management and Analog Technology Innovations at Electronica 2014

Intersil Corporation (NASDAQ: ISIL), a leading provider of innovative power management and precision analog solutions will showcase its technology innovations at the Electronica international trade show in Munich Germany from November 11-14, 2014. Several highly differentiated Intersil products, including bridge drivers, radiation hardened ICs, and analog and sensor ICs will be demonstrated at three distribution
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Rutronik presents RZ/A1H based industrial CPU module from emtrion

emtrion extends its DIMM family with a new industrial processor module, based on the Cortex-A9 RZ/A1 family from Renesas. It is available at distributor Rutronik as of now. The module is fully compatible with the other modules of the emtrion DIMM series, both electrically and mechanically. It can be put into operation immediately on one
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Microsemi Announces Collaboration with Broadcom to Expand Broadband Product Portfolio for Next Gen xDSL Applications

New Reverse Power Feed Technology is a Critical Technology for Affordable FTTdp and G.fast Deployments in Communications-based Solutions Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, recently introduced at the Broadband World Forum (BBWF) 2014 its new reverse power feed (RPF) technology, a critical technology for
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Test instruments from Yokogawa are playing a key part in the development of a new family of cost-effective electric vehicles being developed jointly by two German companies

Nov 3, 2014

Leading fork-lift truck manufacturer Linde Material Handling GmbH of Aschaffenburg, together with Karabag, based in Hamburg, have converted a conventional FIAT 500 into an electric car. The Karabag 500E is a conventional Fiat 500 retrofitted with an electric drive. The vehicle has a 3-phase asynchronous motor, providing 20 kW of nominal power, and a 125
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Mouser Team Wins Top Marketing Honors from ECIA

Mouser Electronics, Inc., the global authorized distributor with the newest semiconductors and electronic components, congratulates its Marketing Team for winning several top Electronics Choice Industry Awards from the Electronic Components Industry Association (ECIA) at the ECIA’s annual executive conference on October 27 in Chicago.    The ECIA, an industry leading non-profit organization dedicated to supporting
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Ruggedized optical MT backplane interconnect system from Molex enabling simple installation and maintenance now available through TTI, Inc.

Molex’s VITA 66.1 ruggedized optical MT backplane interconnect system enables simple installation and maintenance for rugged embedded VPX MIL/AERO backplane applications and can now be sourced from TTI, Inc., a world leading specialist distributor of passive, connector, electromechanical and discrete components. Ideal for high-density aerospace, defence and commercial embedded system applications and fully compliant with
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Aerco gains AS9120 approval

Aerco has been awarded AS9120 approval.  AS9100/AS9120 is the International Aerospace Industry quality management standard with AS9100 applying to companies that design and manufacturer products for the aerospace industry while AS9120 is applicable to stockists and distributors. Aerco quality manager, Alan Jackson, said: “This approval, issued by BSI, demonstrates our commitment to the continuous improvement
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