BREAKING NEWS: Hyperstone U8 inside TERZ KALIBER-XS, IP67 M12 USB Flash Drives      Diamond Electronics features dishwasher safe antimicrobial coated keyboards at Southern Manufacturing & Electronics Show 2018      Cadence Appoints Anirudh Devgan as President      Coax connector system for small cell mobile communications from HUBER+SUHNER      Sub-miniature PCB mount Toggle Switch from JPR Electronics saves panel and PCB space     
Industry News

Green Hills Software’s INTEGRITY-178 tuMP Multicore Operating System Integrated into the Resilient Embedded GPS/Internal Navigation System Prototype Pilot

Oct 24, 2017

Infinite Dimensions Integration Selects Proven Leader in DO-178B Level A and EAL 6+ Operating Systems for an Airborne Demonstrator of the FACE Basic Avionics Lightweight Source Archetype Framework   Green Hills Software, the worldwide leader in high assurance operating systems, has announced that it has been selected by Infinite Dimensions Integration to provide its INTEGRITY®-178 tuMP™
Read more…

Intertronics advance superior adhesive performance through plasma surface treatment

Recent work by engineers at Intertronics’ partners Relyon Plasma has demonstrated the substantial increases in bond strength achievable with the use of plasma surface treatment, which can improve adhesion on many substrates, including those which are seen as difficult to bond. Plasma surface treatment can enable otherwise impractical bonds and improve assembly performance, while saving
Read more…

Cliff FT Connectors now available pre-assembled into 1U, 19” rack Panels

Oct 17, 2017

Cliff Electronics is now offering system integrators 1U, 19” rack panels pre-assembled with up to 16 of their market–leading Feedthrough (FT) connectors to simplify system assembly, reduce manufacturing time, component count and cost. The panels have 16 x 24mm holes to accept the XLR format Cliff FT connectors with options of threaded M3x0.50 or #4-40
Read more…

EnOcean Alliance to exhibit at Smart Buildings Show 2017:The self-powered wireless standard for smart buildings

The organization will be presenting its maintenance-free wireless solutions, creating a network for the integrated control of smart buildings and IoT applications based on the seamless integration of self-powered sensors and switches with local controls, gateways and building management systems.   At the 2017 Smart Buildings Show in London (November 8-9, 2017) at booth #E5,
Read more…

New small quantities storage facility at Rutronik

Rutronik Elektronische Bauelemente GmbH has set up a small quantities storage facility. The new storage facility allows the distributor from Ispringen to quickly supply development engineers and companies that have smaller requirements with single items and partial quantities. The small quantities are available exclusively on the e-commerce platform Rutronik24.com. “The new small quantities storage facility
Read more…

Mouser Electronics Signs Global Distribution Agreement with LinkSprite to Offer Arduino-Compatible Boards

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announced that it has signed a global distribution agreement with LinkSprite, designers and producers of hardware, firmware, and apps focused on home automation, health care, and more. The LinkSprite product line available from Mouser
Read more…

Yokogawa to conduct PoC Test of Remote Pump Monitoring Service using its IIoT Architecture

Creating new value by working with partner companies   Yokogawa Electric Corporation announces that it has begun working with Iwaki Co., Ltd. on a proof-of-concept (PoC) test for a remote pump monitoring service. This service will use an Industrial IoT (IIoT) architecture that is currently under development by Yokogawa. The PoC test will examine the
Read more…

Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX™ Process Technology

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES 22FDX™ process technology. The Cadence® tools enable advanced-node customers across a variety of vertical markets — including automotive, mobile, internet of things (IoT) and consumer applications — to
Read more…

Anritsu, Teledyne LeCroy Integrate Best-in-Class Solutions to Create Industry’s Most Comprehensive PCI Express® 4.0 Test System

MP1900A BERT with LabMaster 10Zi-A Oscilloscope Performs Automated PCIe Gen4 Transmitter, Receiver and Link Equalization Tests with Support Up To 32 Gb/s   Anritsu Company U.S. and Teledyne LeCroy announce today a partnership to provide the industry’s most capable PCI Express® 4.0 (PCIe Gen4) test solution, integrating the Anritsu Signal Quality Analyzer (SQA) MP1900A BERT
Read more…

BVM’s new LS-37K 3.5” SBC based on 6th generation Skylake and 7th generation Kaby Lake

Further extending its 3.5”  format industrial grade embedded SBC portfolio, BVM has announced the LS-37K, which offers a 30% performance improvement and power reduction over Ivy Bridge based units when using the 6th generation Skylake Core i7/i5/i3 processors, and even higher improvements when based on the latest 7th generation Kaby Lake. The LS-37K also supports
Read more…

Skyscraper

Skyscraper 2

Skyscraper 3

Skyscraper 4

Skyscraper 5

Skyscraper 6