BREAKING NEWS: Marvell Introduces Industry’s First Wi-Fi, Bluetooth 5 and 802.11p Combo Solutions for Vehicle-to-Everything (V2X) and In-Vehicle Infotainment (IVI)      Melexis announces availability of highly integrated Time-of-Flight 3D vision solution      Vishay Intertechnology IR Receivers in TVCastSMD Package Offer High Remote Control Performance for Flat-Panel TVs and Monitors      SEGGER introduces compact version of J-Link for verification and test beds      New 450W 1U 3”x5” Power Supply from Gresham Power Electronics has Industrial and Medical approvals     
New products

Han-Eco® Outdoor connector offers weatherproof seals and A-sized housings

Jun 20, 2017

The HARTING Han-Eco® A Outdoor connector is a new variant of the company’s Han-Eco® family, which combines high-performance plastic construction with weatherproof seals for use outdoors. The new version offers standard A-sized housings for configuring robust and flexible interfaces in demanding environmental conditions. The benefits of Han-Eco® A housings now extend to outdoor use, especially the option
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Mouser Offers ON Semiconductor’s IoT Modular Platform for Smart and Connected Cloud-Based Apps

Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the IoT Development Kit (IDK) from ON Semiconductor. Combining hardware and software elements to enable rapid implementation of smart and connected cloud-based applications, ON Semiconductor’s IoT Development Kit provides engineers with all of the building blocks needed to
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Toshiba launches innovative 4-channel car audio power amplifier IC

Toshiba Electronics Europe announced the launch of a new 4-channel 49W power amplifier IC that detects output offset voltage even during playback, a key factor in speaker burnout. The TCB502HQ integrates a newly developed, full-time output offset detection circuit that operates even during sound reproduction, thereby preventing speaker burnout. Intended for hi-fi grade audio systems
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Anritsu Provides Cost-Effective Solution for RF and Protocol Conformance Tests of 3GPP-Compliant LTE Mobile Terminals

Simple Conformance Test System ME7800L Supports GCF/PTCRB RF/Protocol Conformance Tests for LTE Deployments   Today, Anritsu Corporation release the ME7800L, a Simple Conformance Test System, which enables simple and cost-effective RF and Protocol conformance tests of 3GPP-compliant LTE mobile terminals in one simple package. Anritsu Corporation is recognized by the Mobile Terminals Industry as a
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Rutronik presents IC for Batteryless RF Communication from Panasonic

Panasonic has extended its range of NFC tags with the MN63Y1221-E1, a new IC for batteryless RF communication. It guarantees global interoperability as well as low power consumption. The new IC is available at www.rutronik24.com as of now. The MN63Y1221-E1 is compliant with JISX6319-4 (212kbps/ 424kbps), ISO/IEC14443 Type A (106kbps), and ISO/IEC14443 Type B (106kbps/212kbps/424kbps)
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New Line of Compact, Encapsulated Ac-Dc Power Supplies Ranging From 6 W to 20 W

CUI’s Power Group today introduced a new line of low power, encapsulated ac-dc power supplies to their broad power portfolio ranging from 1 W to 12 kW. Housed in a compact, encapsulated board mount package with industry standard pin-outs, the new PSK series offers models with 6, 10, 15, and 20 W of continuous power.
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New 450W 1U 3”x5” Power Supply from Gresham Power Electronics has Industrial and Medical approvals

Gresham Power Electronics the Salisbury based Defence and Commercial power conversion specialist, announces the introduction of the UI450 Series of single output 450W power supplies from Polytron Devices, the USA based leading designer and supplier of standard and customisable power conversion products. The UI450 fits in a 1U enclosure and has dimensions of 127 ×
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Melexis announces availability of highly integrated Time-of-Flight 3D vision solution

New chipset simplifies design of robust and future-proof solutions for automotive, industrial and smart cities   Melexis, a global microelectronics engineering company, today announces a new Time-of-Flight (ToF) chipset and development kit that enables simple, modular and future proof design of 3D vision solutions. Previously available only as part of a development system, the chipset
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Marvell Introduces Industry’s First Wi-Fi, Bluetooth 5 and 802.11p Combo Solutions for Vehicle-to-Everything (V2X) and In-Vehicle Infotainment (IVI)

Marvell extends a complete product portfolio of Ethernet and wireless automotive connectivity solutions with fourth generation family of wireless SoCs enabling advanced infotainment, telematics and Wi-Fi gateways for the connected car   Marvell (NASDAQ:MRVL), a leader in storage, networking, and connectivity semiconductor solutions, today announced the 88W8987xA, the world’s first automotive-grade system-on-chip (SoC) to integrate the
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SEGGER introduces compact version of J-Link for verification and test beds

SEGGER introduces the J-Link BASE Compact and the J-Link PLUS Compact. The compact variants of the J-Link models are designed for minimal footprint and to mount securely and unobtrusively into development or end user equipment. Two mounting holes and small size make it simple to place the J-Link into existing equipment housings or to reserve
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