BREAKING NEWS: Bridgetek Strengthens PanL System In Order to Explore New Opportunities in Smart Homes & Beyond      Riedon announces major expansion with acquisition of Deltec Shunts      Rutronik at embedded world 2018: hall 3A, booths 317 and 400      Microsemi and Imperas Announce Extendable Platform Kit for Microsemi Mi-V RISC-V Soft CPUs      Vishay Intertechnology Industrial Potentiometer Membrane Displacement Sensors Offer High Durability and Repeatability for Harsh Environments     
New products

Microsemi Extends Leadership in Satellite Electronics with New Radiation Tolerant Telemetry Controller IC Providing Key Functions for Sensor Monitoring, Attitude and Payload Control

Mar 31, 2015

The LX7730 Space System Manager IC Offers Significant Weight Reduction, Board Space Savings and Increased Reliability Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced the first member of its new radiation tolerant Space System Manager (SSM) family of special purpose mixed signal devices, the
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Vishay Intertechnology Wet Tantalum Capacitor Approved to DLA 15005, Offers Improved Vibration Capability, Thermal Shock, and Reverse Voltage for Avionics and Aerospace Systems

Mar 24, 2015

Vishay Intertechnology, Inc. (NYSE: VSH) today introduced a new tantalum-cased wet tantalum capacitor with a glass-to-tantalum hermetic seal that is approved to Defense Logistics Agency (DLA) drawing 15005. For avionics and aerospace systems, the device is the industry’s first wet tantalum capacitor approved to DLA 15005 to combine a reverse voltage of 1.5 V at
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Murata introduces highly efficient 7kW 3-phase AC/DC power supply ideal for datacentres, broadcast and industrial applications

Murata today announced the D2U5T-H3-7000 3-phase input hot-swappable AC/DC power supply from Murata Power Solutions. This fan cooled highly efficient supply, typically up to 95.5% overall efficiency at 50% full load, provides a 54 VDC main output at up to 7,000 Watts from a 480 VAC input. A user selectable standby output offers either 3.3
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GTK expands TFT range to include “Letterbox” footprint modules

GTK announced the expansion of its TFT display products to include a series of “Letterbox” footprint modules as part of its standard range, which are available in sizes ranging from 3.9” to 11”. “These new sizes are ideal for new markets where the traditional TFT sizes weren’t really suitable,” said Clive Dickinson, Business Manager for
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Toshiba Expands Line-up of e•MMC™ Version 5.1 Compliant Embedded NAND Flash Memory Products

New flash memory products support command queuing and secure write protection features Toshiba Electronics Europe announced the launch of JEDEC e•MMCTM Version 5.1[1] compliant embedded NAND flash memory products supporting “command queuing” and “secure write protection”. The new products integrate NAND chips fabricated with 15nm process technology with a controller to manage basic control functions
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FTDI Chip Adds Graphic Toolchain Package to its EVE Offering

New widget-based development tool assists user interface designer professionals without need for EVE display list knowledge Bringing more comprehensive support to its Embedded Video Engine (EVE) product offering, FTDI Chip introduces EVE Screen Designer – which is available to download for free. Suitable for use with Windows operating systems (Windows 7 and above), this highly
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Power Integrations Extends Compact 1200 V/1700 V SCALE-2+ Dual-Driver-Core Family with More Protection Features

Embedded paralleling simplifies design; EMC-robust; Advanced Active Clamping (AAC) or Soft Shut Down (SSD) Power Integrations (Nasdaq: POWI), a leader in IGBT-driver technology, today launched its latest SCALE™-2+ dual IGBT-driver core, the 2SC0435T2G1-17, which is the most compact product in its power range with a footprint of only 57.2 x 51.6 mm and a height
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HARTING Han-Modular® hinged frame allows integration with High Mating Cycle connectors

Mar 23, 2015

HARTING has added a new hinged frame to the Han-Modular® range of industrial connectors. The new frame allows Han-Modular® components to be integrated with the company’s family of High Mating Cycle (HMC) connectors, which are designed to handle more than 10,000 mating cycles. The new Han-Modular® Hinged Frame HMC incorporates a specially plated PE (Protective
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GaN Systems’ gallium nitride power semiconductors now with topside cooling for simpler PCB design

GaNPX™ packaging enables use of conventional heat dissipation techniques GaN Systems Inc., a leading developer of gallium nitride power switching semiconductors, today announces new topside cooling technology in its wide range of high-power enhancement-mode devices. Topside cooling enables engineers to use conventional, well-understood PCB cooling techniques when incorporating GaN Systems’ market-leading semiconductors into their latest
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OMC announces flexible Tx/Rx pairs for glass or polymer fibre systems

Interchange polymer & glass cables without changing transmitter/receiver OMC, a pioneer in optoelectronics manufacturing, has announced a flexible fibre optic transmitter/receiver pair that enables systems designers to develop links using polymer fibre, then upgrade to glass fibre if the distances involved extend beyond the range of polymer. The company has pioneered the use of its
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