BREAKING NEWS: Bridgetek Strengthens PanL System In Order to Explore New Opportunities in Smart Homes & Beyond      Riedon announces major expansion with acquisition of Deltec Shunts      Rutronik at embedded world 2018: hall 3A, booths 317 and 400      Microsemi and Imperas Announce Extendable Platform Kit for Microsemi Mi-V RISC-V Soft CPUs      Vishay Intertechnology Industrial Potentiometer Membrane Displacement Sensors Offer High Durability and Repeatability for Harsh Environments     

Anglia distributes Renesas solutions

Oct 24, 2017

Anglia Components today announced that it has extended its successful relationship with Intersil to distribute Renesas’ advanced embedded semiconductor solutions in the UK and Ireland. The announcement follows the acquisition of Intersil by Renesas Electronics Corporation in February. Achim Mescher, Sales Director for Distribution at Renesas Electronics Europe GmbH explained, “One of our first steps
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FTDI Chip Unveils New Chinese Language Website

FTDI Chip is taking further steps to gain greater traction in the Far East. The company has made major investment into a creating a capacious, easy-to-navigate website that focusses specifically on the needs of customers located in the increasingly important markets that have emerged out of China. This comprehensive new online resource not only covers
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SEGGER Embedded Studio IDE now free for Nordic SDK users

SEGGER Microcontroller has announced that, through close collaboration with ultra low power (ULP) RF specialist Nordic Semiconductor ASA, it has been able to make SEGGER’s professional cross platform integrated development environment (IDE)  Embedded Studio available for free to all Nordic Semiconductor customers. The agreement signed between SEGGER and Nordic Semiconductor entitles Nordic customers to use
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Green Hills Software’s INTEGRITY-178 tuMP Multicore Operating System Integrated into the Resilient Embedded GPS/Internal Navigation System Prototype Pilot

Infinite Dimensions Integration Selects Proven Leader in DO-178B Level A and EAL 6+ Operating Systems for an Airborne Demonstrator of the FACE Basic Avionics Lightweight Source Archetype Framework   Green Hills Software, the worldwide leader in high assurance operating systems, has announced that it has been selected by Infinite Dimensions Integration to provide its INTEGRITY®-178 tuMP™
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Intertronics advance superior adhesive performance through plasma surface treatment

Recent work by engineers at Intertronics’ partners Relyon Plasma has demonstrated the substantial increases in bond strength achievable with the use of plasma surface treatment, which can improve adhesion on many substrates, including those which are seen as difficult to bond. Plasma surface treatment can enable otherwise impractical bonds and improve assembly performance, while saving
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Smart Factory Expo: The Digital Manufacturing Show

HARTING features efficiency improvements in manufacturing logistics based on Integrated Industry 4.0 and IoT At Smart Factory Expo, HARTING is demonstrating its range of automation solutions for improving the efficiency of manufacturing logistic processes based on the concepts of Integrated Industry 4.0 and the Internet of Things (IoT) (Stand SO17). HARTING’s approach to smart manufacturing
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Mouser Electronics Signs Global Distribution Agreement with LinkSprite to Offer Arduino-Compatible Boards

Oct 17, 2017

Mouser Electronics, Inc., the industry’s leading New Product Introduction (NPI) distributor with the widest selection of semiconductors and electronic components, today announced that it has signed a global distribution agreement with LinkSprite, designers and producers of hardware, firmware, and apps focused on home automation, health care, and more. The LinkSprite product line available from Mouser
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Yokogawa to conduct PoC Test of Remote Pump Monitoring Service using its IIoT Architecture

Creating new value by working with partner companies   Yokogawa Electric Corporation announces that it has begun working with Iwaki Co., Ltd. on a proof-of-concept (PoC) test for a remote pump monitoring service. This service will use an Industrial IoT (IIoT) architecture that is currently under development by Yokogawa. The PoC test will examine the
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Cadence Announces Digital and Signoff Flow Support for Body-Bias Interpolation for GLOBALFOUNDRIES 22FDX™ Process Technology

Cadence Design Systems, Inc. (NASDAQ: CDNS) today announced that its digital and signoff flow, from synthesis to timing and power analysis, supports body-bias interpolation for the GLOBALFOUNDRIES 22FDX™ process technology. The Cadence® tools enable advanced-node customers across a variety of vertical markets — including automotive, mobile, internet of things (IoT) and consumer applications — to
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Cliff FT Connectors now available pre-assembled into 1U, 19” rack Panels

Cliff Electronics is now offering system integrators 1U, 19” rack panels pre-assembled with up to 16 of their market–leading Feedthrough (FT) connectors to simplify system assembly, reduce manufacturing time, component count and cost. The panels have 16 x 24mm holes to accept the XLR format Cliff FT connectors with options of threaded M3x0.50 or #4-40
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