BREAKING NEWS: Bridgetek Strengthens PanL System In Order to Explore New Opportunities in Smart Homes & Beyond      Riedon announces major expansion with acquisition of Deltec Shunts      Rutronik at embedded world 2018: hall 3A, booths 317 and 400      Microsemi and Imperas Announce Extendable Platform Kit for Microsemi Mi-V RISC-V Soft CPUs      Vishay Intertechnology Industrial Potentiometer Membrane Displacement Sensors Offer High Durability and Repeatability for Harsh Environments     
News

EnOcean Alliance to exhibit at Smart Buildings Show 2017:The self-powered wireless standard for smart buildings

Oct 17, 2017

The organization will be presenting its maintenance-free wireless solutions, creating a network for the integrated control of smart buildings and IoT applications based on the seamless integration of self-powered sensors and switches with local controls, gateways and building management systems.   At the 2017 Smart Buildings Show in London (November 8-9, 2017) at booth #E5,
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New small quantities storage facility at Rutronik

Rutronik Elektronische Bauelemente GmbH has set up a small quantities storage facility. The new storage facility allows the distributor from Ispringen to quickly supply development engineers and companies that have smaller requirements with single items and partial quantities. The small quantities are available exclusively on the e-commerce platform Rutronik24.com. “The new small quantities storage facility
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Anritsu, Teledyne LeCroy Integrate Best-in-Class Solutions to Create Industry’s Most Comprehensive PCI Express® 4.0 Test System

MP1900A BERT with LabMaster 10Zi-A Oscilloscope Performs Automated PCIe Gen4 Transmitter, Receiver and Link Equalization Tests with Support Up To 32 Gb/s   Anritsu Company U.S. and Teledyne LeCroy announce today a partnership to provide the industry’s most capable PCI Express® 4.0 (PCIe Gen4) test solution, integrating the Anritsu Signal Quality Analyzer (SQA) MP1900A BERT
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BVM’s new LS-37K 3.5” SBC based on 6th generation Skylake and 7th generation Kaby Lake

Further extending its 3.5”  format industrial grade embedded SBC portfolio, BVM has announced the LS-37K, which offers a 30% performance improvement and power reduction over Ivy Bridge based units when using the 6th generation Skylake Core i7/i5/i3 processors, and even higher improvements when based on the latest 7th generation Kaby Lake. The LS-37K also supports
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Panduit to exhibit at Productronica 2017 Exhibition

Oct 10, 2017

Innovative and flexible, end-to-end electrical infrastructure solutions that provide businesses with the ability to keep pace with a connected world   Panduit Corp., an industry leader in wire harness, heavy duty cable management, identification, plant floor and control panel solutions for over 60 years, will be exhibiting at Productronica 2017 Exhibition from 14th to 17th
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Rutronik Number One for College Graduates

Rutronik Elektronische Bauelemente GmbH is the most attractive employer for college graduates in the “wholesale” category, according to “Deutschland Test”. With 100 out of 100 possible points, the distributor sets the standard. When choosing an employer, college graduates greatly value a friendly working environment, a healthy work-life balance, advancement opportunities and job security. Money is
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Panasonic Industry Europe Repositioned to Provide Solutions-based Competence Service for European Customers

Strong localized customer management and value added services put customers first for sustainable growth in Europe   Panasonic Industry Europe today announced that the company has created leaner processes and unified business divisions to provide high quality capabilities and efficient technical solutions across a broad portfolio of products and services, and to bring the company’s
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Plextek RFI and Filtronic Broadband develop 26GHz SMT module for 5G

Collaborative multi-chip module development addresses lack of components for  European 5G ‘Pioneer Band’   Plextek RFI, a UK design house specialising in microwave and millimetre-wave IC design, has announced that it has developed a multi-chip module (MCM) to cover the recently-designated European ‘Pioneer Band’ for millimetre-wave (mmWave) 5G around 26GHz. The development of the Front-End
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Parker Chomerics extends thermal management support for electric and hybrid vehicles

THERM-A-GAP gels aid BEV/PHEV battery performance, longevity, safety & reliability   Parker Chomerics has extended its range of products for the automotive sector to include thermal management solutions for batteries in electric and hybrid electric vehicles (BEV/PHEV). The company’s products are already used extensively to provide thermal management, electromagnetic shielding and environmental sealing in other
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FTDI Chip Unveils Engineering Community Focussed On its Worldwide Customer Base

Striving to make life easier for engineers, FTDI Chip has just launched an online community. Bringing an additional dimension to the company’s existing array of technical support capabilities, this new engineering resource is designed to encourage ongoing interaction between its members – providing a knowledge base that facilitates the sharing of ideas and project information.
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