BREAKING NEWS: Marvell Introduces Industry’s First Wi-Fi, Bluetooth 5 and 802.11p Combo Solutions for Vehicle-to-Everything (V2X) and In-Vehicle Infotainment (IVI)      Melexis announces availability of highly integrated Time-of-Flight 3D vision solution      Vishay Intertechnology IR Receivers in TVCastSMD Package Offer High Remote Control Performance for Flat-Panel TVs and Monitors      SEGGER introduces compact version of J-Link for verification and test beds      New 450W 1U 3”x5” Power Supply from Gresham Power Electronics has Industrial and Medical approvals     
Tech Articles

The Direction of Wireless Charging Technology By Landa Culbertson, Mouser Electronics Featured Products

Jul 16, 2014

Mobile devices, with always-on GPS and wireless, high-performance video and audio technology, ever-increasing applications, and near-constant use, have perceived shorter battery life in spite of improvements in battery technology. This has created a demand for more convenient and accessible ways to charge mobile gadgets. Fulfilling these needs are the wireless charging systems available on the
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OmniTek, Xilinx Roll Zynq-7000 Video Development Kit – The new OZ745 platform eases the design of real-time professional broadcast and other apps

By Mike Santarini, Publisher, Xcell Journal, Xilinx, Inc. Xilinx and Xilinx Alliance member OmniTek will release a real-time video-processing platform targeted at companies creating high-bandwidth equipment for a wide range of motion-picture industries. The new platform, called the OmniTek OZ745 Zynq™-7000 SoC Video Development Kit, includes all the key components to help OEMs improve system
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Wearable Electronics- Feature Article by Caroline Hayes

Wearable technology is moving on from a fitness band or a smartwatch, to a broad range of hobbyist-inspired products and may even do away with passwords. This change of pace follows on the heels of the Wearable Tech Show in London (and ahead of Wearable Tech Expo, in New York, next month), where smartphones and
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How to create the perfect display/board partnership By David Potts, Divisional Marketing Manager Anglia Embedded & Pamela Lin, Product Manager, Advantech

Thousands of display and board combinations offer systems integrators huge flexibility in application design, but make it a challenge to integrate screen and processor. The display is the ‘public face’ of an electronic system, and users’ assessment of the quality and the performance of their system is greatly influenced by how it is presented. The
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Best-in-Class Grid-Protection for Next-Generation PV Inverters By Steve Drumm, Omron Europe

The latest standards for grid-connected solar inverters call for high-performing electromagnetic relays that are designed specifically for grid-protection duties As consumers’ dependence on electricity continues to increase, and governments seek to meet carbon reduction targets by increasing reliance on renewable energy sources, an increasing number of small solar plants are expected to supply energy to
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Powering ahead with SiC research – Feature Article by Caroline Hayes

After recently heading to Nuremberg for PCIM Europe 2014, my head is filled with thoughts of power: power management, energy efficiency, new regulations and alternative power sources. I realised this had become an obsession when listening to someone discussing the use of ‘Sic’ after a phrase, and I immediately thought of silicon carbide (SiC) before
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Automotive Grade Silicon Capacitors for ‘Under the Hood’ Applications

Sébastien Jacqueline, Laurent Lengignon, Laëtitia Omnès, IPDiA, 2 rue de la Girafe, 14000 Caen,” target=”_blank”>,, +33 (0) 2 31535406 Abstract This paper covers technological results achieved with silicon capacitors in low power automotive applications (smart sensors) including stability and reliability data at high temperatures. Size constraints of the capacitors for ‘under the hood’
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Planning to achieve low impedance package traces By: Jitesh Shah, Integrated Device Technology

Planning to achieve low impedance package traces By: Jitesh Shah, Integrated Device Technology Compared to traditional wirebond approaches, flip-chip interconnects provide a better option where superior electrical performance and high signal density are required. However, if the chip I/O floor-planning is not well thought out and optimised for the application, then the benefit of the
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