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Tech Articles

Planning to achieve low impedance package traces By: Jitesh Shah, Integrated Device Technology

Jul 16, 2014

Planning to achieve low impedance package traces By: Jitesh Shah, Integrated Device Technology Compared to traditional wirebond approaches, flip-chip interconnects provide a better option where superior electrical performance and high signal density are required. However, if the chip I/O floor-planning is not well thought out and optimised for the application, then the benefit of the
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