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Tech Articles

Power Semiconductor Building Blocks For The More Electric Vehicle – Benjamin Jackson, Senior Manager, Automotive Strategic Marketing & Business Development, Product Manager IGBTs & Modules

Jul 16, 2014

It is no secret that the automotive industry is currently going through a major period of technological change. The fuel pumps and pistons used in the internal combustion engine for over 100 years are now being traded for lithium ion batteries, inverters and IGBTs. In short the vehicle is becoming more electric. On first pass
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Power Semiconductors Driving the Electric Vehicle Industry By Landa Culbertson, Mouser Electronics

With more than 6.5 million electric vehicles (EVs) on the road today, and annual worldwide sales projections by Pike Research reaching 3.8 million by 2020, demand for semiconductors in the automotive environment is heating up. In fact, Semicast Research calculates that “revenues for original equipment (OE) automotive semiconductors grew by 12% to USD $25.5 billion
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The Direction of Wireless Charging Technology By Landa Culbertson, Mouser Electronics Featured Products

Mobile devices, with always-on GPS and wireless, high-performance video and audio technology, ever-increasing applications, and near-constant use, have perceived shorter battery life in spite of improvements in battery technology. This has created a demand for more convenient and accessible ways to charge mobile gadgets. Fulfilling these needs are the wireless charging systems available on the
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OmniTek, Xilinx Roll Zynq-7000 Video Development Kit – The new OZ745 platform eases the design of real-time professional broadcast and other apps

By Mike Santarini, Publisher, Xcell Journal, Xilinx, Inc. Xilinx and Xilinx Alliance member OmniTek will release a real-time video-processing platform targeted at companies creating high-bandwidth equipment for a wide range of motion-picture industries. The new platform, called the OmniTek OZ745 Zynq™-7000 SoC Video Development Kit, includes all the key components to help OEMs improve system
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Wearable Electronics- Feature Article by Caroline Hayes

Wearable technology is moving on from a fitness band or a smartwatch, to a broad range of hobbyist-inspired products and may even do away with passwords. This change of pace follows on the heels of the Wearable Tech Show in London (and ahead of Wearable Tech Expo, in New York, next month), where smartphones and
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How to create the perfect display/board partnership By David Potts, Divisional Marketing Manager Anglia Embedded & Pamela Lin, Product Manager, Advantech

Thousands of display and board combinations offer systems integrators huge flexibility in application design, but make it a challenge to integrate screen and processor. The display is the ‘public face’ of an electronic system, and users’ assessment of the quality and the performance of their system is greatly influenced by how it is presented. The
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Best-in-Class Grid-Protection for Next-Generation PV Inverters By Steve Drumm, Omron Europe

The latest standards for grid-connected solar inverters call for high-performing electromagnetic relays that are designed specifically for grid-protection duties As consumers’ dependence on electricity continues to increase, and governments seek to meet carbon reduction targets by increasing reliance on renewable energy sources, an increasing number of small solar plants are expected to supply energy to
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Powering ahead with SiC research – Feature Article by Caroline Hayes

After recently heading to Nuremberg for PCIM Europe 2014, my head is filled with thoughts of power: power management, energy efficiency, new regulations and alternative power sources. I realised this had become an obsession when listening to someone discussing the use of ‘Sic’ after a phrase, and I immediately thought of silicon carbide (SiC) before
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Automotive Grade Silicon Capacitors for ‘Under the Hood’ Applications

Sébastien Jacqueline, Laurent Lengignon, Laëtitia Omnès, IPDiA, 2 rue de la Girafe, 14000 Caen,” target=”_blank”>,, +33 (0) 2 31535406 Abstract This paper covers technological results achieved with silicon capacitors in low power automotive applications (smart sensors) including stability and reliability data at high temperatures. Size constraints of the capacitors for ‘under the hood’
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Planning to achieve low impedance package traces By: Jitesh Shah, Integrated Device Technology

Planning to achieve low impedance package traces By: Jitesh Shah, Integrated Device Technology Compared to traditional wirebond approaches, flip-chip interconnects provide a better option where superior electrical performance and high signal density are required. However, if the chip I/O floor-planning is not well thought out and optimised for the application, then the benefit of the
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