Mouser Electronics, Inc., the authorized global distributor with the newest semiconductors and electronic components, is now stocking the zCD™ Interconnect System connector from Molex. Offering a high level of integration, performance, long-term reliability and a compact form-factor that will help enable widespread adoption of 400 Gbps technology, the zCD connector from Molex supports high-bandwidth, next-generation Ethernet applications in telecommunications, networking, and enterprise computing environments.
The Molex zCD Interconnect System connector, now available from Mouser Electronics, enables 4.4 TBps with 11 modules on a line card to support next-generation 400 Gigabit Ethernet. Part of Molex’s zCD Interconnect System, this short-body passive connector accepts both passive and active copper cables. The compact form factor is constructed on a straight, back-route footprint with a 0.75 mm pitch. The small pitch eliminates footprint side-routing, and the overall design of the connector provides industry-leading port-count density with close placement along the panel.
Molex’s zCD Interconnect System connector comes equipped with an elastomeric gasket for superior electromagnetic interference (EMI) containment and suppression, a press-fit connector design to ensure a robust and simple board termination, and excellent thermal management that accepts a broad range of customer-specified thermal modules and heat sinks. The connector is ideal for a wide variety of Ethernet-based applications, including telecommunication devices, core switches, routers, data centers, enterprise computing devices, Top of Rack (TOR) switches, and any other Ethernet application requiring 400 Gbps interfaces.
To learn more, visit http://www.mouser.com/new/molex/molex-zcd-interconnect-system-connectors/.